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- Table des matières
- MARQUE LIVRES
- Features 1
- Applications 1
- Description 1
- Contents 2
- List of tables 4
- List of figures 5
- 1 Hardware specification 6
- 1.4 Current consumption 7
- 1.5 RF compliance limits 7
- 1.6 Pin assignment 8
- 1.7 Pin placement 9
- 1.8 Hardware block diagram 9
- 2 Hardware design 10
- 2.3 Layout guidelines 11
- Hardware design SP1ML 12
- Figure 4. Layout guidelines 12
- 2.4 Recommended footprint 13
- Figure 6. Soldering profile 14
- 3 Module operation 15
- Module operation SP1ML 16
- Table 9. Command reference 16
- 3.4 Configuration registers 17
- SP1ML Module operation 19
- 3.5 Information registers 21
- 3.6 Example command sequence 21
- 4 ECOPACK 22
- 5 Package mechanical data 22
- 6 Regulatory compliance 23
- 24/27 DocID026906 Rev 3 24
- 7 Ordering Information 25
- 8 Revision history 26
- 27
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