Enable-IT 350 Manuel d'utilisateur télécharger pdf (Page 15)

NCV8772

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PACKAGE DIMENSIONS

DPAK 5, CENTER LEAD CROP

CASE 175AA

ISSUE A

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

5 PL

0.13 (0.005) T

−T−

SEATING

PLANE

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.235 0.245 5.97 6.22

B 0.250 0.265 6.35 6.73

C 0.086 0.094 2.19 2.38

D 0.020 0.028 0.51 0.71

E 0.018 0.023 0.46 0.58

F 0.024 0.032 0.61 0.81

G 0.180 BSC 4.56 BSC

H 0.034 0.040 0.87 1.01

J 0.018 0.023 0.46 0.58

K 0.102 0.114 2.60 2.89

L 0.045 BSC 1.14 BSC

R 0.170 0.190 4.32 4.83

S 0.025 0.040 0.63 1.01

U 0.020 −−− 0.51 −−−

V 0.035 0.050 0.89 1.27

Z 0.155 0.170 3.93 4.32

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

R1 0.185 0.210 4.70 5.33

1234 5

6.4

0.252

0.8

0.031

10.6

0.417

5.8

0.228

SCALE 4:1

inches

0.34

0.013

5.36

0.217

2.2

0.086

SOLDERING FOOTPRINT*

1 2 ... 10 11 12 13 14 15 16 17

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